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ESD Anti-Static Waffle Pack Tray for IC Chips with High Temperature Resistance and Customizable Cavity Sizes

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ESD Anti-Static Waffle Pack Tray for IC Chips with High Temperature Resistance and Customizable Cavity Sizes

Name: ESD AntiStatic Waffle Pack Tray for IC Chips with High Temperature Resistance and Customizable Cavity Sizes
Brand: Hiner-pack
Price: 1.35 USD

ESD Anti-Static Waffle Pack Tray for IC Chips with High Temperature Resistance and Customizable Cavity Sizes Manufactures

Brand Name : Hiner-pack

Model Number : HN24175

Certification : ROHS, ISO

Place of Origin : China

MOQ : 500 pcs

Price : $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）

Payment Terms : T/T

Supply Ability : 2000PCS/Day

Delivery Time : 10 workdays

Packaging Details : CARTON, PALLET

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Color : Black

Quality Assurance : Delivery Guarantee, Reliable Quality

Outline Line Size : 50.7×50.7×7.4 mm

Cavity Size : 1.30x1.15x0.72 mm

Incoterms : EXW, FOB, CIF, DDU, DDP

Mold Type : Injection

Reusable : Yes

Tray Shape : Rectangular

Clean Class : General And Ultrasonic Cleaning

Ic Type : BGA,QFP,QFN,LGA,PGA

Packing Level : Transport package

Warpage : Warpage MAX 0.2mm

Capacity : 17x18=306 PCS

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ESD Anti-Static Waffle Pack Trays for Semiconductor IC Chips

This tray provides reliable ESD protection for IC chips. It prevents static damage and contamination during handling. Its cross-slot structure holds components securely.

It fits semiconductor testing, die sorting, and packaging processes. It works well in cleanroom and automated production environments. It withstands high temperatures up to 125℃.

It supports IC chip turnover, storage, and logistics. It offers customizable cavity sizes and layouts. Tailored designs meet diverse semiconductor packaging needs.

Key Features/ Benefits

Deliver effective ESD anti-static performance
Withstands 125℃ high temperatures.
Offers secure IC chip storage.
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24175
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×7.4 mm
Cavity Size		1.30x1.15x0.72 mm
Matrix QTY		17x18=306 PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

It applies to semiconductor encapsulation, IC testing, die sorting, and wafer processing. It adapts to high-precision manufacturing and cleanroom operations.

It supports chip internal turnover, long-term storage, and logistics. It meets various integrated circuit processing and assembly requirements.

Packaging & Shipping/ Services

Custom cross-slot waffle tray services are available. Tailor cavity size, layout, and material for specific IC models. Create exclusive solutions to meet unique semiconductor packaging needs.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

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ESD Anti-Static Waffle Pack Tray for IC Chips with High Temperature Resistance and Customizable Cavity Sizes Images

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ESD Anti-Static Waffle Pack Tray for IC Chips with High Temperature Resistance and Customizable Cavity Sizes

ESD Anti-Static Waffle Pack Tray for IC Chips with High Temperature Resistance and Customizable Cavity Sizes

ESD anti-static waffle pack trays

semiconductor IC chip trays

waffle pack trays for electronics

ESD Anti-Static Waffle Pack Tray for IC Chips with High Temperature Resistance and Customizable Cavity Sizes Images