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Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging

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Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging

Name: Durable JEDEC IC Trays for DustFree Semiconductor Wafer Packaging
Brand: Hiner-pack
Price: 1.35 USD

Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging Manufactures

Brand Name : Hiner-pack

Model Number : HN25004

Certification : ROHS, ISO

Place of Origin : China

MOQ : 500 pcs

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）

Payment Terms : T/T

Supply Ability : 2000PCS/Day

Delivery Time : 10 workdays

Packaging Details : CARTON, PALLET

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Color : Black

Quality Assurance : Delivery Guarantee, Reliable Quality

Cavity Size : 322.6×135.9×7.62 mm

Incoterms : EXW, FOB, CIF, DDU, DDP

Mold Type : Injection

Reusable : Yes

Tray Shape : Rectangular

Clean Class : General And Ultrasonic Cleaning

Ic Type : BGA,QFP,QFN,LGA,PGA

Packing Level : Transport package

Flatness : Less than 0.76mm

Capacity : 7x23=161 PCS

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Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging

Provide stable protection for delicate wafers throughout packaging processes. Maintain clean working conditions with effective dust control. Built with strong structure to support long-term industrial use. Searching for dependable tray solutions for semiconductor production?

Fit high-standard manufacturing environments and automated production lines. Ensure stable performance during wafer handling and transfer processes. Adapt to various semiconductor packaging procedures smoothly.

Support safe storage and transportation of wafers. Accept customized sizes and structures to meet different production needs. Provide tailored solutions for diverse semiconductor packaging requirements.

Key Features/ Benefits

Strong durable structure
Stable wafer protection
Safeguard wafer packaging processes
Comply with JEDEC standards
Flexible customization

Specifications

Brand		Hiner-pack
Model		HN25004
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×7.62 mm
Cavity Size		13×7.5×7.62 mm
Matrix QTY		7x23=161 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Widely used in semiconductor wafer packaging, chip testing, die sorting and device manufacturing. Suitable for cleanroom production, automated assembly lines and high-precision processing workshops. Perfectly match various wafer level packaging processes and ensure stable performance in strict production environments.

Also applied to wafer storage, factory logistics, production turnover and sample delivery. Meet requirements of semiconductor packaging plants, testing centers and electronic component manufacturers. Support safe and efficient operation of the whole semiconductor production and supply chain.

Customized Services

Provide professional customized services for JEDEC IC trays according to customer needs. Support personalized design of cavity size, arrangement and material. Create exclusive tray structures for different wafers and packaging processes. Offer one-stop tailored solutions to improve production efficiency and meet special application requirements in semiconductor manufacturing.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging Images

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